We render:

• laser cut of ceramic substrates (in alumina),
• thick-film resistor laser correction in the tolerance to 0.1%,
• details cut on eccentric press,
• inject of polymer elements,
• cut tape on ring-scissors from 0,15 to 0,6,
• nut thread M10 x 0,75 and M7 x 0,75,
• tool sharpening grinder way adjustment,
• assembly of components on hand and pneumatic press,
• cutting, peel insulation of, tin, solder wires,
• diffrent kind of joint,
• we are leading also selling of rivets, washers and nuts.

We provide services in designing, making of prototypes, control-tests and production of hybrid thick film on ceramic substrates. We makes prototypes of this structures under received specification. If you are interested, please contact with technical department.

Technology and application description

Thick film hybrid is an alternative technology for printed PCB circuit. The passive elements are deposit directly into ceramic substrate and like the conductive layers, fired at temperature of 850 ºC. In this process we can obtain a big packing of elements and can eliminate to minimum the quantity of solder connections. The structures made like this are reliable, durable and smaller than classical PCB structures. Can work underwater, in dust and generally in environment where other solutions doesn't works. That is why those are mainly used into air and military equipment, medical devices, control and measurement equipment, mining automation, railway devices and in all places where the reliable in difficult and variable of working conditions is necessary.

Other property of thick film hybrid in ceramic substrates are:

• good warm draining by ceramic substrate,
• miniaturization and reduction of weight and dimensions,
• small sensibility for inductive interference,
• frequency up to 80 GHz,
• possibility of resistance laser correction to 0,1 %,
• stable structures value, fired from ruthenium pastes in temperature of 850 ºC.

You can see below some machinery used for production:

If you are interested, send us a message to the following adress:

e-mail: logistyka@telpod.krakow.pl